Core Viewpoint - Hengkun New Materials has initiated its public offering, with a total share capital of 382 million shares before the issuance, and plans to issue 67.4 million shares, accounting for 15% of the post-issue total share capital [1] Group 1: IPO Details - The public offering price is set at 14.99 yuan per share, with an issuance price-to-earnings ratio of 71.42 times, compared to the industry average of 60.47 times [1] - The maximum subscription limit for a single account is 10,500 shares, with subscriptions required to be in multiples of 500 shares [1] - The online subscription date is November 7, 2025, with the announcement of the winning numbers and payment date on November 11, 2025 [1] Group 2: Company Products and Applications - The company's products are primarily used in the production processes of advanced NAND and DRAM storage chips, as well as logic chips at 90nm technology nodes and below, including lithography and thin film deposition [1] Group 3: Fundraising Allocation - The company plans to allocate 399.8 million yuan to the second phase of the integrated circuit precursor project and 606.9 million yuan to the advanced materials project for integrated circuits [1] Group 4: Financial Performance - Total assets for 2024 are projected at 2.645 billion yuan, an increase from 2.091 billion yuan in 2023 and 1.633 billion yuan in 2022 [2] - Net assets are expected to reach 1.501 billion yuan in 2024, up from 1.382 billion yuan in 2023 and 1.273 billion yuan in 2022 [2] - Operating revenue is forecasted at 547.9 million yuan for 2024, compared to 367.7 million yuan in 2023 and 321.8 million yuan in 2022 [2] - The net profit attributable to shareholders is projected at 96.9 million yuan for 2024, slightly up from 89.8 million yuan in 2023 but down from 100.9 million yuan in 2022 [2] - Research and development investment is expected to be 88.6 million yuan in 2024, representing 16.17% of operating revenue [2]
恒坤新材今日申购 10.50万市值可顶格申购
Zheng Quan Shi Bao Wang·2025-11-07 01:41