新股消息 | 圣邦股份(300661.SZ)拟港股IPO 中国证监会要求说明近三年技术出口业务的开展情况及合规性

Group 1 - The China Securities Regulatory Commission (CSRC) has published supplementary material requirements for overseas listing applications, specifically requesting Saintbond Technology to clarify its technology export business over the past three years and its compliance status [1] - Saintbond Technology has submitted its listing application to the Hong Kong Stock Exchange, with Huatai International and CICC acting as joint sponsors [1] - The CSRC requires that the listing materials and prospectus be consistent regarding the issuance plan, including details on the number of shares issued under the overallotment option and the expected fundraising amount [1] Group 2 - Saintbond Technology is a comprehensive analog integrated circuit (IC) company that develops and sells high-performance analog ICs and sensors, which are fundamental components of all electronic systems [2] - As of September 21, 2025, the company has approximately 6,600 types of analog ICs and sensors across 36 product categories [2]