Xin Lang Cai Jing·2025-11-09 09:08Core Viewpoint - Jinpan Technology (688676.SH) announced on November 7 that the Shanghai Stock Exchange's Sci-Tech Innovation Board Listing Committee held its 51st meeting in 2025 to review the company's plan to issue convertible bonds to unspecified investors, pending approval from the China Securities Regulatory Commission (CSRC) [1] Group 1: Convertible Bond Issuance - The total amount to be raised from the issuance of convertible bonds is not more than 1.6715 billion yuan, after deducting issuance costs [1] - The bonds will be issued at face value of 100 yuan each, with a term of six years from the date of issuance [2] - The interest payment will occur annually, with the principal and final year's interest paid at maturity [3] Group 2: Fund Allocation - The total investment for the projects funded by the issuance includes: - Data center power module and high-efficiency energy-saving equipment manufacturing project: 523.4175 million yuan, with 473.3700 million yuan from the raised funds [1] - High-efficiency liquid-immersed transformers and amorphous alloy core manufacturing project: 734.2182 million yuan, with 616.5300 million yuan from the raised funds [1] - R&D office building construction project: 82.9678 million yuan, with 80.2000 million yuan from the raised funds [1] - Working capital supplement: 501.4000 million yuan, fully funded by the raised funds [1] Group 3: Project Details - The projects include: - Digital factory for data center power modules in Tongxiang: 228.5092 million yuan total investment, with 199.2000 million yuan from raised funds [1] - VPI transformer digital factory project in Tongxiang: 294.9083 million yuan total investment, with 274.1700 million yuan from raised funds [1] - Intelligent transformation of the liquid-immersed transformer workshop in Wuhan: 192.8882 million yuan total investment, with 164.9300 million yuan from raised funds [1] - Digital factory project for amorphous alloy core in Shaozhou: 541.3300 million yuan total investment, with 451.6000 million yuan from raised funds [1] Group 4: Underwriting and Representation - The lead underwriter for this issuance is Zheshang Securities Co., Ltd., with representatives Miao Miao and Lu Yingfeng [4]