联得装备：目前在半导体行业领域的设备主要集中在芯片封装测试设备领域

Core Viewpoint - The company is focusing on the semiconductor industry, particularly in the field of chip packaging and testing equipment, and is committed to increasing R&D investment in this area [1] Group 1: Company Focus - The company's equipment in the semiconductor sector primarily includes advanced packaging and testing devices such as display driver chip COF flip chip machines, semiconductor flip chip machines, soft solder die bonding machines, eutectic die bonding machines, film laminating machines, and lead frame inspection machines [1] - The company is actively expanding its presence in advanced packaging processes and third-generation semiconductor-related equipment, addressing both market and technological aspects [1] Group 2: R&D and Business Development - The company plans to continuously increase its R&D investment in semiconductors to enhance its new business segment's industrial layout [1] - The goal is to promote the development of the company's semiconductor equipment business segment [1]