Core Insights - SCHMID Group has successfully secured two significant orders in the rapidly growing field of Panel Level Packaging and mSAP production Equipment [1][4] Company Developments - The first project involves delivering a cluster configuration of InfinityLine C+ and InfinityLine H+ equipment to a leading global technology company in Southeast Asia, which specializes in semiconductors and infrastructure software [2][3] - The second project includes supplying horizontal InfinityLine H+ and vertical InfinityLine V+ machines to a customer in China, aimed at expanding mSAP capacities for AI Server PCB and similar products [3] Market Context - The orders highlight SCHMID Group's increasing role in advanced electronics manufacturing amid unprecedented AI-driven demand [4] - Global semiconductor revenues are projected to reach $785 billion in 2025 and accelerate toward $1.1 trillion by 2029, primarily driven by AI-centric architectures and data-intensive computing [5] - A 24% year-over-year increase in AI server shipments is forecasted for 2025, with North American hyperscalers leading the demand [5] Industry Trends - The surge in AI infrastructure investment is reshaping the IC-substrate and advanced PCB ecosystem, with a notable rise in demand for large-body substrates to meet next-generation performance requirements [6] - SCHMID's advanced process equipment portfolio is strategically relevant for enabling scalable, high-yield manufacturing for next-generation packaging technologies [6] Executive Insights - The projects reflect customer confidence in SCHMID's ability to deliver reliable and scalable production solutions for next-generation Advanced Packaging, as stated by the company's CSO [7]
SCHMID Group secures major orders for Panel Level Packaging (PLP) and modified-Semi-Additive (mSAP) production equipment