恒运昌冲刺科创板 半导体核心部件“小巨人”开启资本新征程

Core Viewpoint - Shenzhen Hengyun Chang Vacuum Technology Co., Ltd. is set to go public on November 14, aiming to raise 1.469 billion yuan for semiconductor RF power system industrialization and intelligent production projects [1][3] Company Overview - Hengyun Chang is a leading enterprise in the core component field of semiconductor equipment, recognized as a national high-tech enterprise and a key "little giant" in specialized and innovative sectors [1][2] - The company has developed three product series over ten years, with the latest series achieving performance levels comparable to international leaders, breaking the overseas monopoly in the market [2] Financial Performance - From 2022 to 2024, the company's revenue is projected to grow from 158 million yuan to 541 million yuan, reflecting a compound annual growth rate (CAGR) of 84.91% [1] - The net profit attributable to the parent company is expected to increase from 19.61 million yuan to 129 million yuan during the same period [1] Product and Market Position - The core product, the plasma RF power system, is essential for semiconductor manufacturing, influencing chip yield and process precision [1] - Hengyun Chang has established deep partnerships with leading domestic semiconductor equipment manufacturers, becoming a strategic supplier in critical processes [2] Strategic Initiatives - The company is pursuing a dual-driven strategy of "internal R&D + external acquisitions" to capitalize on the domestic semiconductor industry's growth opportunities [2] - Significant investment in R&D is planned, with over 150 million yuan allocated from 2022 to mid-2025, aiming for over 40% of personnel in R&D by the end of 2024 [2] Future Outlook - The IPO proceeds will enhance production capacity and accelerate the commercialization of core technologies, positioning the company to meet the growing market demand [3] - Hengyun Chang aims to strengthen its competitive advantage in the semiconductor industry and establish itself as a global supplier of core components for plasma processes [3]