Nextool Technology (SH:688419) Xin Lang Cai Jing·2025-11-11 07:49Core Viewpoint - The company, NAIKE Equipment, is involved in the semiconductor packaging and plastic extrusion molding sectors, focusing on intelligent manufacturing equipment and solutions, with a significant portion of its revenue coming from overseas due to the depreciation of the RMB [4][8]. Group 1: Company Overview - NAIKE Equipment was established on October 8, 2005, and went public on November 7, 2022, specializing in the research, production, and sales of intelligent manufacturing equipment for semiconductor packaging and plastic extrusion molding [8]. - The company's main products include semiconductor packaging equipment, plastic extrusion molding molds, and downstream equipment, with revenue composition being 64.66% from plastic extrusion molding molds, 26.93% from semiconductor packaging equipment, and 4.94% from semiconductor packaging molds [8]. Group 2: Financial Performance - For the period from January to September 2025, NAIKE Equipment achieved a revenue of 220 million yuan, representing a year-on-year growth of 11.59%, and a net profit attributable to shareholders of 66.24 million yuan, up 14.70% year-on-year [9]. - The company reported that as of September 30, 2024, overseas revenue accounted for 60.53% of total revenue, benefiting from the depreciation of the RMB [4]. Group 3: Market Activity - On November 11, the stock price of NAIKE Equipment fell by 1.44%, with a trading volume of 40.43 million yuan and a turnover rate of 2.33%, leading to a total market capitalization of 3.288 billion yuan [1]. - The stock has shown no significant trend in major capital inflows, with a net outflow of 1.09 million yuan on the day of analysis, ranking 67th out of 166 in its industry [5][6]. Group 4: Industry Context - NAIKE Equipment operates within the electronic semiconductor equipment sector, with its business aligned with concepts such as integrated circuits, semiconductors, advanced packaging, and specialized manufacturing [9]. - The company is actively upgrading its packaging equipment to support advanced packaging forms like FCCSP and FCBGA, indicating a focus on innovation in semiconductor manufacturing processes [2][3].