鸿日达(301285.SZ)：拟设立控股子公司开展半导体引线框架业务

Core Viewpoint - The company, Hongri Da (301285.SZ), has approved the establishment of a holding subsidiary, Hongke Semiconductor (tentative name), in collaboration with Fujian Tedu Technology Co., Ltd. and Shanghai Hongke Tongchuang Enterprise Management Partnership (Limited Partnership) to engage in the research, design, manufacturing, and sales of semiconductor packaging lead frames [1] Group 1: Investment and Strategic Development - The investment aims to align with the company's strategic layout and operational development needs [1] - The management has been authorized to sign investment-related agreements and handle the establishment of the holding subsidiary [1] Group 2: Industry Context and Market Demand - The semiconductor lead frame business is a critical material for semiconductor packaging, serving as a carrier for semiconductor chips and a bridge for internal circuits to external connections [1] - The performance requirements for lead frames include strength, flexibility, conductivity, and thermal conductivity, playing multiple roles such as stabilizing chips, conducting signals, and transferring heat [1] - There is a growing market demand for semiconductor lead frames driven by the miniaturization and integration of electronic products, as well as the increasing need for high-performance and high-reliability semiconductor devices in emerging applications like artificial intelligence, 5G, the Internet of Things, and new energy vehicles [1]