江波龙：截至三季度末 自研主控芯片累计部署量突破1亿颗

Core Insights - The company has achieved a cumulative deployment of over 100 million self-developed main control chips by the end of Q3, with rapid growth in deployment scale continuing [2] - The UFS 4.1 products equipped with the company's self-developed main control chips are currently undergoing introduction and validation stages with multiple Tier 1 manufacturers [2] - The overall deployment scale of self-developed main control chips is expected to see significant growth throughout the year [2]