Tower Semiconductor Announces New CPO Foundry Technology Available On Tower’s Leading Sipho and EIC Optical Platforms

Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as Co-Packaged Optics, including full support by Cadence design tools to the stacked platform technology Migdal Haemek, Israel – November 12, 2025 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced the expansion of its existing, mature 300mm wafer bonding technology, origi ...