芯联资本完成首期主基金12.5亿元募集 将聚焦硬科技领域投资

Core Insights - ChipLink Capital has successfully raised its first main fund with a total scale of 1.25 billion yuan, expected to exceed 1.5 billion yuan, focusing on hard technology sectors such as semiconductors, artificial intelligence, robotics, and new energy [1][2] - The fund's investor base includes prominent companies and institutions, reflecting strong market confidence in hard technology investments and recognition of ChipLink Capital's investment strategies and expertise [2][3] Fundraising and Investor Composition - The fund was raised in less than a year, showcasing a highly market-oriented LP structure amidst a challenging fundraising environment, indicating investor confidence in the long-term development of China's hard technology and strategic emerging industries [2] - Key investors include ChipLink Integrated Circuit Manufacturing Co., Ltd., Shanghai Lingang New Area Private Equity Fund Management Co., Ltd., and various other leading firms and financial institutions [1] Investment Strategy and Portfolio - ChipLink Capital's investment strategy is driven by a "capital + industry" dual approach, leveraging deep industry resources from its parent company in the semiconductor sector to expand the industrial chain and build an ecosystem [3] - The firm has invested in several well-known companies within the semiconductor and new energy sectors, as well as emerging applications in robotics and AI, including notable projects like Super Fusion and Digua Robotics [3]