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Group 1 - Company plans to raise up to 2.6 billion yuan through a private placement of shares, marking its first equity refinancing since its IPO in 2021 [1] - The raised funds will be allocated to the construction of an AI computing HDI production base, a smart manufacturing high-layer circuit board project, and to supplement working capital and repay bank loans [1] - The AI computing HDI production base project has a total investment of 2.032 billion yuan, with 1 billion yuan planned to be raised from this offering, aiming for an annual production capacity of 167,200 square meters [1] Group 2 - The demand for AI computing power is driving significant growth in the AI server and data center market, particularly increasing the demand for HDI boards [2] - AI HDI boards are expected to become one of the fastest-growing segments in the PCB market over the next five years, with a particular emphasis on high-tier HDI boards [2] - The market demand for high-layer and high-speed PCBs is expected to grow rapidly due to technological advancements in AI server and data center products [2] Group 3 - As of November 17, the company's stock closed at 93.4 yuan per share, with a market capitalization of 77.7 billion yuan [3]