Core Viewpoint - The consumer electronics industry is entering a new AI-driven iteration cycle, with mobile phones and smart wearables becoming the best entry points for AI applications. Canalys predicts that by 2028, the shipment proportion of AI smartphones will exceed 50%, driving a surge in demand for high-end PCBs due to increased terminal integration [1]. Group 1: Company Positioning and Strategy - The company, Kexiang Co., is a leading PCB manufacturer in China, with nearly 20% of its revenue coming from consumer electronics. It has established deep integration into the supply chains of major brands like ZTE and Xiaomi through a dual strategy of direct partnerships and ODM indirect channels, positioning itself to benefit from the industry's super cycle [1][2]. - Kexiang Co. has a high sales proportion of high-end consumer electronics PCBs, particularly for smartphones, and has formed partnerships with several well-known ODM manufacturers, making it a significant supplier in the smartphone PCB industry [2][3]. - The company has been collaborating with ZTE since 2020, and starting in 2024, it will upgrade its product orders to focus on mid-to-high-end PCBs for mobile phones and communication devices, with steadily increasing unit prices [3]. Group 2: Technological Advancements and Product Offerings - Kexiang Co. is leveraging its advanced technology to meet the high-density integration demands of AI smartphones, capable of mass-producing 14-16 layer HDI boards with a minimum line width/spacing of 0.05mm, suitable for multi-chip collaborative computing [5]. - The company's high-frequency and high-speed boards utilize low-loss dielectric materials, ensuring signal transmission stability that meets the standards of major clients like Huawei and ZTE, making them suitable for high-speed data processing scenarios in AI terminals [5]. - Kexiang Co. has entered the supply chains of AR glasses manufacturers like Meta and Rokid with its ePOP storage products, positioning itself in the emerging virtual and augmented reality terminal market. The company has accumulated over 300 authorized patents and plans to invest 6% of its R&D budget in 2024, particularly in high-end fields like MiniLED packaging substrates [6]. Group 3: Market Outlook and Growth Potential - The company is expected to benefit from the increasing penetration of AI terminals, which will drive demand for high-end PCBs. Its strong customer matrix and technological reserves create synergistic advantages, positioning it to achieve simultaneous growth in volume and profit during the industry's super cycle [6]. - In the short term, the improving consumer electronics market is likely to release incremental orders for Kexiang Co. from collaborations with clients like ZTE, Xiaomi, Samsung, and DJI [6].
消费电子PCB需求激增,科翔股份发力AI手机终端大周期