智通财经网·2025-11-20 07:07Core Viewpoint - Qualcomm (QCOM.US) is potentially evaluating Intel (INTC.US) for manufacturing its application-specific integrated circuits (ASIC) for data centers, as indicated by job postings seeking candidates with Intel's embedded multi-chip interconnect bridge packaging technology [1] Group 1: Qualcomm - Qualcomm is looking to leverage Intel's manufacturing services to comply with the U.S. CHIPS and Science Act, which aims to boost domestic semiconductor production [1] - The company maintains a "neutral" rating on Qualcomm [1] Group 2: Intel - Intel is significantly behind TSMC (TSM.US) in the packaging business, which has lower pricing and profit margins compared to front-end manufacturing [1] - Data center-specific integrated circuits account for less than 1% of Intel's sales, indicating that any potential deals with Qualcomm and others would not significantly impact Intel's revenue from contract manufacturing [1] - Intel is rated "sell" by Citigroup [1] Group 3: Other Companies - Apple (AAPL.US) and Broadcom (AVGO.US) are also reported to have similar job postings, suggesting they may be exploring partnerships with Intel for manufacturing [1]