光莆股份：公司的光集成传感3D叠Die封装产品主要应用在智能手机、智能穿戴、无人机、机器人、AR/VR 等领域

Core Viewpoint - The company Guangpu Co., Ltd. (300632) has highlighted its 3D stacked die packaging products, which are primarily used in various high-tech fields such as smartphones, smart wearables, drones, robots, and AR/VR applications, indicating a strong market presence and technological relevance [1] Group 1 - The company's 3D stacked die packaging products are based on technology similar to high bandwidth memory (HBM) but are differentiated by their specific applications [1]