集成电路ETF（159546）跌超3%，行业复苏与封装技术突破引关注，回调或可布局

Core Insights - The semiconductor industry is rapidly shifting towards packaging technology, with advanced packaging and bonding techniques identified as key breakthroughs to overcome critical challenges, serving as the next growth engine for the industry [1] - Technologies such as hybrid bonding and non-solder bonding are maturing, facilitating advancements in 3D packaging and heterogeneous integration towards higher density and reliability [1] - New materials like nano-silver sintering are being adopted to address traditional bonding materials' thermal expansion coefficient matching issues [1] - The demand from sectors like 5G, AI, and automotive electronics is increasing the requirements for chip heat dissipation efficiency and signal transmission speed, making advanced packaging a crucial pathway to enhance computing power cost-effectiveness amid the slowing of Moore's Law [1] - Domestic companies are entering high-end markets such as HBM and power semiconductors from the mid-to-low-end market, although they still rely on international suppliers like ASM Pacific for key equipment and materials [1] - The global advanced packaging market is expected to reach $65 billion by 2027, with hybrid bonding technology projected to grow the fastest, and advanced packaging is anticipated to surpass traditional packaging as the mainstream technology by 2026 [1] - The integrated circuit ETF (159546) tracks the integrated circuit index (932087), which selects listed companies involved in semiconductor design, wafer manufacturing, packaging testing, and related materials and equipment, effectively reflecting the overall performance of core enterprises in China's integrated circuit industry [1]