兴森科技：目前内资载板厂商中具备FCBGA封装基板量产能力的企业有公司、深南电路等

Core Viewpoint - The company, Xingsen Technology, has confirmed its position in the FCBGA packaging substrate market, highlighting the competitive landscape among domestic manufacturers [1] Group 1: Company Insights - Xingsen Technology is one of the domestic manufacturers capable of mass production of FCBGA packaging substrates [1] - Other companies with similar capabilities include Shenzhen South Circuit, Zhuhai Yuya, and Anjieli Meiwai, each with varying production capacities, technical capabilities, and mass production progress [1]