华正新材：高速覆铜板及铝塑膜均已实现量产并取得相应营收

Core Insights - Huazheng New Materials has achieved mass production and revenue generation for its high-speed copper-clad laminates and aluminum-plastic films [2] Group 1: Product Performance - CBF materials exhibit excellent dielectric properties, thermal expansion coefficients, peel strength, insulation performance, and processability, making them suitable for semiconductor packaging applications such as CPU/GPU, RFPA, and PMIC [2] - BT packaging materials offer high heat resistance, resistance to CAF, low dielectric constant, and low expansion coefficient, which are advantageous for applications in MicroLED, Memory, VCM, and PMIC [2]