再添4家！风险分担工具护航民营股权投资机构科创债发行

Core Insights - The issuance of technology innovation bonds by private equity investment institutions is increasing, with four firms planning to issue a total of 930 million yuan, indicating a growing trend of private equity firms utilizing the interbank bond market for financing under policy support [1] Group 1: Financing and Investment Support - The risk-sharing tool provides credit enhancement for three private equity firms, significantly improving the credit quality of their bonds, with collateral provided by equity stakes in invested companies or their own equity [1] - The risk-sharing tool will act as a "cornerstone investor" in the bond issuance of the four private equity firms, facilitating their financing efforts [1] - Since the previous issuance on June 18, five firms have utilized nearly 50% of the raised funds, leveraging over 10 billion yuan in total for investments in key sectors such as integrated circuits, artificial intelligence, biomedicine, and new materials [1] Group 2: Market Development and Policy Support - The trading association plans to continue utilizing risk-sharing tools to develop the bond market's "technology board," aiming to attract more financial resources for early-stage, small, long-term, and hard technology investments [2]