第二批来了！4家民营股权投资机构拟发科创债9.3亿元

Core Viewpoint - The second batch of technology innovation bonds (科创债) supported by risk-sharing tools is set to be issued in the interbank market from November 26 to 28, following a successful roadshow on November 24, aimed at providing financial support for technology innovation activities [1] Group 1: Issuance and Participants - Four private equity investment institutions are participating in the second batch of technology innovation bonds, aiming to raise a total of 930 million yuan [1] - The institutions involved include 基石资产管理股份有限公司 (基石资本), 深圳同创伟业资产管理股份有限公司, 盛景嘉成投资管理有限公司, and 上海道禾长期投资管理有限公司 [1] - 基石资本 plans to issue 400 million yuan of bonds as part of a larger 1.5 billion yuan issuance over two years, with most funds directed towards future investments in technology innovation [1] Group 2: Funding and Support Mechanisms - The technology innovation bonds have a term of up to 10 years, aligning with the investment horizon of the managed innovation funds [2] - The risk-sharing tools have significantly enhanced the issuance capacity of the bonds, providing a basic funding guarantee for the innovation funds established over the next two years [2] - Three of the four participating companies received credit enhancement from the risk-sharing tools, while one received market-based credit enhancement from 中债信用增进投资股份公司 [2] Group 3: Market Impact and Future Outlook - As of November 21, the interbank market has supported 276 companies in issuing technology innovation bonds totaling 534.6 billion yuan, with the issuance scale exceeding 10% of the total debt financing tools in the market for the first time [3] - The participation of private enterprises in the technology bond market has increased, with 55 private companies issuing 107.4 billion yuan, accounting for 20% of the total issuance [3] - The risk-sharing tools have effectively leveraged funds into key sectors such as integrated circuits, artificial intelligence, biomedicine, and new materials, demonstrating the ongoing support for technology innovation [3]