4家民营股权投资机构拟发科创债9.3亿元

Group 1 - The second batch of technology innovation bonds supported by risk-sharing tools will be issued from November 26 to 28, with a total of 930 million yuan from four private equity investment institutions [1] - The first batch of five private equity investment institutions successfully issued technology innovation bonds with risk-sharing tools on June 18, indicating a growing trend of private equity financing through the interbank bond market [1] - The risk-sharing tools significantly enhance the credit level of the bonds, with three institutions providing collateral through equity stakes, while one institution utilizes market-based guarantees [1] Group 2 - Nearly 50% of the funds raised by five companies from the first batch have been utilized, leveraging over 10 billion yuan into key sectors such as integrated circuits, artificial intelligence, biomedicine, and new materials [2] - The trading association plans to continue utilizing risk-sharing tools to develop a "technology board" in the bond market, aiming to attract more financial resources for early-stage, small, long-term, and hard technology investments [2]