传日本芯片制造商Rapidus拟建设1.4纳米晶圆厂，加速追赶台积电(TSM.US)

Core Insights - Rapidus plans to start construction of its second factory in Hokkaido in FY2027, with production of 1.4nm chips expected to begin as early as 2029, aiming to close the gap with TSMC [1][2] - The project is estimated to cost trillions of yen, with the Japanese government providing hundreds of billions of yen in initial funding for R&D, marking a significant step in revitalizing Japan's semiconductor industry [1][3] - The second factory is projected to have total investments exceeding 2 trillion yen and will also potentially produce 1nm chips [1][2] Investment and Funding - The Japanese government will cover a significant portion of the funding, with additional financing coming from loans backed by the government and investments from private enterprises [1][3] - In April 2024, Japan approved approximately 590 billion yen (about 39 billion USD) in subsidies for Rapidus as part of efforts to boost domestic semiconductor manufacturing [3] Technological Development - Starting from FY2026, Rapidus plans to fully initiate R&D for 1.4nm products while continuing collaboration with IBM for 2nm technology [2] - Rapidus aims to set large-scale production targets for nodes smaller than 1.4nm, which could help secure long-term customers [2] Competitive Landscape - After starting production in 2029, Rapidus intends to accelerate large-scale production to keep pace with competitors like Samsung and Intel, who are facing challenges in improving yield rates for their advanced products [3] - TSMC plans to begin large-scale production of 2nm chips this year and 1.4nm chips in 2028, while Samsung aims for large-scale production of 1.4nm chips in 2027 [2]