上海芯上微装首台 350nm 步进光刻机宣布发运，国产高端光刻家族再添新成员

Core Insights - Shanghai AMIES has successfully completed the factory debugging and acceptance of its first 350nm stepper lithography machine (AST6200), marking a significant breakthrough in China's high-end semiconductor lithography equipment sector [1][3] Group 1: Product Development - The AST6200 lithography machine is designed based on years of expertise in optical system design, precision motion control, and semiconductor process understanding, emphasizing high performance, reliability, and full autonomy [3] - The machine features high-resolution imaging capabilities, achieving 350nm resolution to meet the lithography process requirements of mainstream compound semiconductor chips [7] - It incorporates a high-precision alignment system for front and back alignment, ensuring precise multi-layer pattern alignment and improving device yield [7] Group 2: Cost Efficiency and Autonomy - The AST6200 is designed for high yield and significantly reduces the cost of ownership (COO) [7] - It is equipped with a fully autonomous software control system developed by AMIES, providing complete sovereignty from the ground up and offering strong process scalability and remote operation capabilities [7] Group 3: Technical Specifications - The machine utilizes a high-intensity I-line light source with a wavelength of 365nm, categorized as deep ultraviolet (UVA) [8] - It features a high-speed linear motor substrate transfer system that supports rapid switching between various substrate sizes (2/3/4/6/8 inches) [8] - The high-speed, high-precision motion stage system achieves a maximum acceleration of 1.5g, significantly enhancing throughput [8] Group 4: Versatility and Compatibility - The AST6200 supports multiple substrate materials including Si, SiC, InP, GaAs, and sapphire, and is compatible with various substrate types such as flat edge, double flat edge, and Notch [8] - It includes an innovative focus and leveling system that can accurately measure transparent, semi-transparent, opaque, and large-step substrates [8] - The machine also supports back alignment modules to meet the complex process requirements of bonded wafers [8]