英特尔取得利用集成熔丝的模块化衬底设计微电子器件专利

Core Viewpoint - Intel has obtained a patent for a microelectronic device utilizing a modular substrate design with integrated fuses, indicating ongoing innovation in semiconductor technology [1] Group 1 - The patent is titled "Microelectronic device utilizing modular substrate design with integrated fuses" [1] - The patent was granted under the announcement number CN 109216318 B [1] - The application date for the patent was May 2018 [1]