强达电路:HDI板最高可实现6阶任意层互联

Core Insights - Strongda Circuit has emphasized its focus on high-density interconnect (HDI) boards, which utilize micro-blind buried hole technology, showcasing features such as high density, fine wiring, and small aperture [2] Group 1: Product Development - The company is actively engaged in the research and development of advanced PCB products, including HDI boards, millimeter-wave radar boards, semiconductor test boards, and optical module boards, which are characterized by high technical difficulty [2] - Strongda Circuit aims to achieve a maximum of 6-layer arbitrary interconnection in its HDI boards, enhancing its product capabilities [2] Group 2: Competitive Strategy - The company is committed to continuous R&D investment to maintain long-term market competitiveness of its products, thereby deepening its technological reserves [2]