Group 1 - Intel has entered a new foundry agreement with Tower Semiconductor, involving a $300 million investment in Intel's Rio Rancho facility in New Mexico [2] - Tower Semiconductor will gain production capacity of over 600,000 photo layers per month to meet customer demand for next-generation 300 mm chips [2] - The collaboration aims to focus on advanced power management and RF SOI solutions, with plans for full process qualification in 2024 [2] Group 2 - Intel's foundry services have seen significant growth, with Q2 revenue reaching $232 million, a year-over-year increase of over 300% [3] - Intel aims to become the second-largest external foundry provider globally by 2030 [3] - Prior to this agreement, Intel and Tower Semiconductor had terminated a previous acquisition deal, with Intel paying a breakup fee of $353 million [3]
收购交易失败后 英特尔与高塔半导体达成新的代工协议