Group 1 - The company successfully raised a total of RMB 254,056.47 million from the public offering of 63.53 million shares at a price of RMB 39.99 per share, with a net amount of RMB 237,483.71 million after deducting issuance costs [1][12][17] - As of September 30, 2025, the company has invested RMB 104,267.05 million in projects and used RMB 75,060.61 million for permanent working capital, with a remaining balance of RMB 63,588.99 million available from the raised funds [1][12][14] - The company has established a dedicated account management system for the raised funds, ensuring compliance with relevant laws and regulations [2][4][12] Group 2 - The company has changed the investment project from "Testing Center Construction Project" to "Chip Testing Industrial Park Construction Project," with a total investment of RMB 144,250.24 million, divided into two phases [7][8] - The first phase of the new project will require an investment of RMB 71,287.30 million, while the second phase will require RMB 72,962.94 million [7][8] - The change in project focus aims to enhance the company's core competitiveness and support the growth of its automotive-grade business [8][9] Group 3 - The company has utilized RMB 5,703.70 million of raised funds to replace pre-invested funds in the investment projects and issuance costs [11] - As of September 30, 2025, the company has not transferred or replaced any investment projects funded by the raised funds [11] - The company has engaged in cash management with temporarily idle raised funds, with a balance of RMB 52,000.00 million allocated for this purpose [12][13] Group 4 - The company has not made any commitments regarding the cumulative returns from the investment projects funded by the raised funds, and thus there are no discrepancies in expected returns [15] - The company has confirmed that the actual use of raised funds aligns with previously disclosed information [17]
上海南芯半导体科技股份有限公司 截至2025年9月30日止前次募集资金 使用情况专项报告