Group 1 - The company, Tianyu Semiconductor, plans to conduct an IPO from November 27 to December 2, aiming to globally offer 30.0705 million H-shares, with 10% allocated for public offering in Hong Kong and 90% for international offering, including a 15% over-allotment option [1] - The offering price is set at HKD 58.00 per share, with expected net proceeds of approximately HKD 1.671 billion if the over-allotment option is not exercised [1] - Approximately 62.5% of the proceeds will be used for capacity expansion over the next five years, 15.1% for enhancing R&D and innovation capabilities, 10.8% for strategic investments and/or acquisitions, 2.1% for expanding global sales and marketing networks, and 9.5% for working capital and general corporate purposes [1] Group 2 - The company specializes in the manufacturing of self-produced silicon carbide (SiC) epitaxial wafers and is the largest manufacturer in China, holding market shares of 30.6% in revenue and 32.5% in sales volume for self-produced SiC epitaxial wafers in 2024 [1] - The company has entered cornerstone investment agreements with Guangdong Original Forest, GF Global, and Glory Ocean, with cornerstone investors agreeing to subscribe for shares totaling approximately HKD 161.5 million [1]
天域半导体今起招股 拟全球发售3007.05万股H股
Zheng Quan Shi Bao Wang·2025-11-27 00:57