Group 1 - Tianyu Semiconductor announced its Hong Kong IPO plan, intending to issue 30,070,500 H-shares at a price of HKD 58 per share, with trading expected to start on December 5 [1] - The company, founded in 2009 and headquartered in Dongguan, Guangdong, is one of the earliest suppliers focused on silicon carbide (SiC) epitaxial technology in China, with a market share of 30.6% in revenue and 32.5% in volume in the SiC epitaxial market for 2024 [1] - Notable shareholders include Huawei and BYD, with CITIC Securities serving as the sole sponsor for the listing [1] Group 2 - The company received approval from the China Securities Regulatory Commission for overseas issuance and domestic unlisted shares "full circulation" in June, planning to issue up to 46,408,650 overseas listed shares [2] - The Hong Kong listing will provide new financing channels for Tianyu Semiconductor, aiding in capacity expansion and strengthening R&D investment to solidify its market position in the SiC epitaxial field [2]
天域半导体确定港股上市方案，发行价58港元12月5日开始交易
Jin Rong Jie·2025-11-27 01:24