Di Yi Cai Jing·2025-11-27 04:16Core Viewpoint - The semiconductor industry is currently facing a significant controversy involving Intel and TSMC, centered around allegations of trade secret theft related to advanced manufacturing processes [1][2]. Group 1: Legal Dispute - TSMC has filed a lawsuit against former senior vice president Luo Wei-ren, accusing him of violating confidentiality agreements and transferring proprietary information about 2nm technology to Intel [1]. - Intel has responded by asserting that it has strict policies in place to prevent the use or transfer of third-party confidential information, labeling TSMC's claims as unfounded rumors [2]. Group 2: Technological Developments - Intel's 18A process technology, which utilizes RibbonFET transistors and PowerVia technology, has commenced mass production in Arizona, achieving a 30% increase in transistor density and a 15% performance improvement at the same energy consumption compared to the previous generation [2]. - The differences between Intel's and TSMC's process technologies are highlighted, with Intel being an early adopter of High-NA EUV technology, which TSMC has not yet implemented [2]. Group 3: Market Dynamics - The global pure wafer foundry industry is projected to see a 33% year-on-year revenue growth in Q2 2025, driven primarily by the application of advanced processes in AI GPU sectors [3]. - Intel's ability to enhance the yield of its 18A process to commercial levels within the next 1-2 years is critical, as failure to do so may result in losing its competitive edge in the high-end foundry market to TSMC and Samsung [3].