三星电子重组HBM团队 并入DRAM开发室

Core Insights - Samsung Electronics has reorganized its high bandwidth memory (HBM) development team, transferring it from the semiconductor division's DS department to the DRAM development room, raising concerns about the impact on HBM business progress and internal collaboration [1][3] Group 1: Organizational Changes - The HBM development team has been dissolved, with its members moving to the design team under the DRAM development room to continue working on next-generation HBM products and technologies [3] - Sun Yong-soo, the former head of the HBM development team, has been appointed as the head of the design team to oversee HBM-related project advancements [3] - The reorganization is expected to be completed within the week, followed by a global strategy meeting next month to review business plans for the upcoming year [3] Group 2: Market Position and Strategy - Samsung has been increasing its investment in the HBM sector and has established partnerships with major tech companies such as NVIDIA, AMD, OpenAI, and Broadcom [3] - The company aims to enhance its core competencies in stacking packaging, bandwidth, energy efficiency, and reliability based on its experience with HBM3 and HBM3E mass production [3] - Analysts believe that integrating HBM development into the DRAM development system could lead to closer collaboration in process evolution, design validation, and mass production [3][4] Group 3: Market Performance and Projections - Samsung's global HBM market ranking fell to third place in Q2 of this year, facing short-term competitive pressure [3] - The company anticipates a recovery in its HBM market share starting next year as the supply scale of HBM4 gradually increases [3] - TrendForce predicts that Samsung's market share in the global HBM market could exceed 30% by 2026, which is seen as a significant reference for strengthening its advanced storage business layout [3]