Group 1 - The core point of the article is that Lenovo (Beijing) Co., Ltd. has obtained a patent for an electronic device, which includes a housing and a temperature sensing component that deforms and moves when the temperature exceeds a preset level [1] - The patent was granted with the announcement number CN 223600197 U, and the application date is November 2024 [1] - The device's design allows for the housing to increase in thickness direction when the temperature sensing component deforms, indicating a potential innovation in electronic device technology [1] Group 2 - Lenovo (Beijing) Co., Ltd. was established in 1992 and is primarily engaged in the manufacturing of computers, communications, and other electronic devices [1] - The company has a registered capital of 565 million Hong Kong dollars and has invested in 107 enterprises [1] - Lenovo has participated in 5,000 bidding projects and holds 1,751 trademark records and 5,000 patent records, along with 238 administrative licenses [1]
联想取得一种电子设备专利,使壳体沿电子设备的厚度方向升高