新时达：公司半导体机器人已批量应用于前道晶圆厂

Core Viewpoint - The company has made significant advancements in the semiconductor robotics sector, achieving domestic substitution of equipment and expanding its customer base in the semiconductor industry [1] Group 1: Company Developments - The company's semiconductor robots cover various semiconductor processes including thermal processing, cleaning, etching, thin film, photolithography, thinning, and bonding [1] - The company has successfully achieved mass application of its products in the production of simulation chips, power chips, sensor chips, and LED chips in front-end wafer fabs [1] - In the first half of the year, the company saw a year-on-year increase in customer numbers and secured bulk orders from leading domestic semiconductor equipment manufacturers [1] Group 2: Product Delivery and Applications - In the third quarter, the company delivered semiconductor wafer transfer robots to multiple front-end and back-end semiconductor process equipment customers [1] - The processes involved in these deliveries include wet cleaning, etching, dry stripping, measurement and inspection, and temporary bonding, covering both front-end and advanced packaging processes [1]