Chan Ye Xin Xi Wang·2025-11-30 01:02Industry Overview - The Chinese bonding machine industry is experiencing rapid development and transformation, playing an irreplaceable role in the manufacturing of integrated circuits, power devices, and optoelectronic devices [1][15] - The industry is driven by continuous national policy support, expanding downstream application markets, and ongoing technological innovation [1][15] Import and Market Trends - In 2024, China's import volume of wire bonding machines is projected to be 10,873 units, a year-on-year increase of 22.78%, with an import value of 4.403 billion yuan, up 22.56% [1][15] - However, in the first three quarters of 2025, the import volume is expected to decline to 7,124 units, a decrease of 13.68%, with an import value of 2.963 billion yuan, down 7.97% [1][15] Domestic Market and Competition - Domestic companies have achieved a certain level of substitution in the mid-to-low-end bonding machine market, but still rely heavily on imports for high-precision and high-efficiency high-end wire bonding machines [1][15] - The industry is characterized by high technical barriers and significant market concentration, with international giants dominating the market while domestic companies strive to catch up [16][17] Key Companies - Major domestic companies include Maiwei Technology, Aotwei, and Tuojing Technology, which are focusing on high-end semiconductor equipment and have shown significant revenue growth [16][18][19] - For instance, Maiwei Technology reported a revenue of 127 million yuan in the semiconductor and display industry for the first half of 2025, a year-on-year increase of 496.9% [18] Industry Development Stages - The bonding machine industry in China has gone through five stages, from complete reliance on imports to achieving breakthroughs in high-end bonding technology [6][7] - The current phase is marked by increasing domestic market share for bonding machines, particularly in the mid-to-high-end market, driven by national policies and market demand [7][15] Policy Support - The industry has received multiple policy supports aimed at accelerating high-end and domestic development, including guidelines for equipment updates and technology upgrades [7][8] Future Trends - The future of the bonding machine industry will focus on technological advancements, including ultra-high precision and smart manufacturing [20][21] - There will be a shift towards integrated solutions that combine multiple functions, moving from standalone bonding processes to comprehensive micro-assembly platforms [22]