Smartkem to Present Disruptive MicroLED Technology at IDW Japan 2025

Core Insights - Smartkem, Inc. is set to present its MicroLED-in-Package (MiP4) Backlight technology at the IDW Japan conference on December 4, 2025, showcasing a significant advancement in organic semiconductor technology [1][2]. Company Overview - Smartkem is focused on developing a new class of organic semiconductor technology, particularly through its proprietary TRUFLEX® semiconductor polymers, which enable low-temperature printing processes compatible with existing manufacturing infrastructure [5][7]. - The company has a robust intellectual property portfolio, including 140 granted patents across 17 families, 14 pending patents, and 40 codified trade secrets [8]. Technology and Product Details - The MiP4 backlight technology utilizes a 'chip-first' MicroLED architecture, which simplifies production, improves yields, and enhances display performance, potentially disrupting the global display market [3][5]. - MiP4 integrates four sub-85um sized MicroLEDs in series, supporting native 12V operation, which reduces power loss and complexity in surface mount technology (SMT) [4][6]. - Compared to traditional Chip-on-Board (COB) methods, MiP4 reduces Gallium Nitride (GaN) usage by 84% while achieving a peak brightness of 34,047 nits in a 400-zone backlight [4][6]. Market Impact - The new MicroLED-in-Package (MiP4) backlight is designed for seamless integration with existing Liquid Crystal Display (LCD) technologies, which currently represent approximately 65% of the global display industry [3][5]. - The technology is expected to lower production costs and is compatible with existing MiniLED die bonding equipment, facilitating industry adoption [6].