Veeco's Laser Spike Annealing (LSA) System Selected by Leading Semiconductor Memory Company for Advanced DRAM Evaluation

Core Insights - Veeco Instruments Inc. has been selected by a leading semiconductor memory company to evaluate its laser spike annealing (LSA) system for advanced DRAM R&D, marking a significant expansion into the DRAM market [1][2] - The evaluation period is expected to last around one year, with follow-on orders anticipated in 2027 and beyond, indicating a strong potential for future revenue growth [1] - The HBM market is projected to grow at a compound annual growth rate (CAGR) of nearly 30% through 2030, potentially reaching $100 billion or more in annualized revenues, highlighting the increasing demand for advanced memory technologies [3] Company Overview - Veeco is an innovative manufacturer of semiconductor process equipment, specializing in technologies such as ion beam, laser spike annealing, lithography, MOCVD, and single wafer etch & clean [4] - The company's LSA platform is designed to meet the high productivity and performance demands of advanced DRAM and HBM production, making it a preferred solution for tier 1 semiconductor manufacturers [2] - Veeco's LSA technology is positioned to support the evolving needs of the semiconductor industry, particularly as demand for HBM and DRAM rises due to AI workloads and next-generation computing [2]