科翔股份：公司子公司华宇华源从事的PLP面板级芯片封装业务主要应用于电源芯片领域

Group 1 - The core viewpoint of the article is that Kexiang Co., Ltd. (300903) announced plans to increase production capacity in its subsidiary Huayu Huayuan, which is engaged in PLP panel-level chip packaging for power chips [1] - The company reported that the research and development progress is going smoothly and there is already a technical accumulation in the field [1] - The announcement was made in response to inquiries from investors during a recent survey [1]