Core Viewpoint - Weihai Bank has successfully issued a 2025 technology innovation bond in the national interbank bond market, with a total issuance scale of 1 billion RMB and a coupon rate of 1.94% [1][3]. Group 1: Bond Issuance Details - The bond issuance scale is 1 billion RMB [1][3]. - The coupon rate for the bond is set at 1.94% [1][3]. - The funds raised from this bond, after deducting issuance costs, will be used to specifically support business in the technology innovation sector, subject to applicable laws and regulatory approvals [1][3][6]. Group 2: Company Information - Weihai Bank is a joint-stock company registered in the People's Republic of China [5]. - The board of directors includes both executive and non-executive members, indicating a structured governance framework [6].
威海银行：成功发行10亿元科技创新债券，票面利率为1.94%