Di Yi Cai Jing·2025-12-02 12:41Core Viewpoint - The company, Shenzhen Circuit, reported a broad and diverse range of products in its packaging substrate business, indicating growth in demand across various downstream sectors, particularly in storage packaging substrates [1] Group 1: Business Overview - The packaging substrate products include module packaging substrates, storage packaging substrates, and application processor chip packaging substrates [1] - These products are primarily used in mobile smart terminals, servers, and storage fields [1] Group 2: Financial Performance - In the third quarter of 2025, the revenue from packaging substrates increased sequentially, with notable growth in demand across all downstream sectors [1] - The most significant growth was observed in the storage packaging substrate segment [1]