中微公司：在先进封装领域全面布局，已发布CCP刻蚀及TSV深硅通孔设备

Group 1 - The company has a comprehensive layout in the advanced packaging field, including high bandwidth memory (HBM) processes [1] - The company's offerings include etching, CVD, PVD, and wafer measurement equipment [1] - The company has already released CCP etching and TSV deep silicon via hole equipment [1]