北京银行首单信用风险缓释凭证助力民营制造业科技创新债券落地

Core Insights - Beijing Bank successfully launched the first phase of the 2025 25 Hengyi CP006 (Sci-tech Bond) credit risk mitigation certificate, with a scale of 50 million yuan and a term of one year [1][4]. Group 1 - The underlying bond is the sixth phase of the technology innovation bond issued by Zhejiang Hengyi Group Co., Ltd. for the year 2025 [1][4].