国风新材:公司目前聚酰亚胺薄膜产品未应用于存储芯片Cpo封装领域

Group 1 - The core viewpoint of the article is that Guofeng New Materials (000859) has clarified that its polyimide film products are currently not applied in the packaging field of storage chip CPO [1] Group 2 - The company responded to investor inquiries on an interactive platform regarding its product applications [1]

GUOFENG-国风新材:公司目前聚酰亚胺薄膜产品未应用于存储芯片Cpo封装领域 - Reportify