Ke Ji Ri Bao·2025-12-04 01:00Core Insights - The total issuance of technology innovation bonds in the market has reached approximately 1.5 trillion yuan, with funds accelerating towards technology innovation entities [1] - The establishment of an 800 billion yuan re-lending program for technology innovation and technological transformation by the Ministry of Science and Technology and the People's Bank of China aims to support over 120,000 technology-based SMEs [1] - The implementation of the "Innovation Points System" and specialized guarantee plans has led to positive outcomes in financial support for major national technology tasks and technology-based SMEs [1] Group 1: Technology Financial System Development - The establishment of a "Technology Board" in the bond market is a key focus for building a technology financial system that aligns with technological innovation, aiming to raise long-term, low-interest, and easily accessible bond funds [2] - Shenzhen has taken the lead in responding to the "Technology Board," issuing a total of 1 billion yuan in technology innovation bonds, primarily targeting cutting-edge fields such as artificial intelligence and biomedicine [2] - The "Investment-Insurance Linkage" model by Shenzhen High-tech Investment Group provides comprehensive services including equity, debt, and diversified financial tools to support startups and small enterprises [2] Group 2: Bond Issuance and Financial Products - Guangdong has issued 102 technology innovation bonds with a total issuance scale of 111.4 billion yuan, ranking second nationwide, with most funds directed towards technology innovation-related fields [3] - The bond market's "Technology Board" leverages its market-oriented advantages to continuously introduce specialized innovative products to support financing for technology-based enterprises [3] - A multi-layered and diversified technology financial service system is being developed to better meet the financing needs of technology-based enterprises at different stages [3] Group 3: Financial Support Mechanisms - The establishment of a coordinated mechanism for technology finance has improved the matching and precision of financial support for technology innovation [4] - A comprehensive financial service plan called "Mid-Stage Insurance and Financing" has been launched, providing 100 billion yuan in bank support and insurance guarantees for mid-stage projects over the next three years [4] - The "拨保贷投" mechanism provides full lifecycle funding support for mid-stage projects, covering various funding needs from project inception to maturity [5] Group 4: Innovation Points System - The "Innovation Points System" is being promoted nationwide to optimize evaluation indicators and provide precise profiles for technology-based SMEs [6] - In Handan, the "科创数智贷" product allows companies to secure loans based on their innovation points ranking, demonstrating the effectiveness of the innovation points system [7] - The upgraded "Innovation Points System 2.0" aims to convert a company's innovation potential into quantifiable credit for financial institutions, enhancing the accessibility and efficiency of technology financial services [8] Group 5: Knowledge Value Credit - Hubei has established a knowledge value credit evaluation model, allowing companies to secure financing based solely on intellectual property and talent value [9] - The "Knowledge Value Credit Loan" program has issued a total of 77.4 billion yuan, supporting 14,916 technology-based enterprises, breaking the traditional asset-backed financing model [11] - The establishment of a risk compensation fund and a scientific knowledge value credit evaluation system has enhanced banks' willingness to lend to technology-based enterprises [10][11]