Core Viewpoint - Tianyue Advanced (02631) has established business partnerships with over half of the top ten global power semiconductor manufacturers, focusing on high-quality silicon carbide substrates for power and RF devices used in electric vehicles, AI data centers, and photovoltaic systems [1] Group 1: Company Performance - Tianyue Advanced's stock rose over 6% in the afternoon session, currently trading at 61.9 HKD with a transaction volume of 215 million HKD [1] Group 2: Industry Insights - According to Huaxi Securities, addressing the thermal management issues of CoWoS packaging is crucial for the development of AI computing chips [1] - If CoWoS replaces the interposer with SiC and follows a projected 35% compound annual growth rate over 28 years, it will require over 2.3 million 12-inch SiC substrates by 2030, equivalent to approximately 9.2 million 6-inch substrates, significantly exceeding current production capacity [1]