Baidu mulls Hong Kong spin-off of Kunlunxin chip unit as China semiconductor deals surge

Core Viewpoint - Baidu is considering a spin-off and Hong Kong listing of its semiconductor arm, Kunlunxin, amid increasing investor interest in China's chip sector [1][5]. Company Developments - Baidu confirmed that Kunlunxin is in the process of preparing for an initial public offering (IPO) in Hong Kong, expected to be filed no earlier than Q1 of next year [1]. - The company cautioned that there is "no assurance" that the proposed spin-off and listing will proceed [2]. - Shares of Baidu rose 3.2% to HK$125.60, following a 5% gain the previous Friday, as investors anticipate that a potential listing could unlock value in its AI chip business [3]. - Kunlunxin recently completed a fundraising round, increasing its valuation to approximately 21 billion yuan (US$2.97 billion) [3]. Industry Context - The move follows the successful debut of Moore Threads Technology, which saw its shares surge fivefold, reflecting renewed optimism in China's semiconductor self-reliance amid ongoing tensions with the United States [4]. - Baidu's chip ambitions align with Beijing's goal of reducing reliance on US suppliers like Nvidia and enhancing domestic capabilities in the global AI race [6]. - Kunlunxin originated as an internal Baidu project focused on intelligent chips, launching its first product, the XPU, in 2017 [6]. - The Kunlun AI chip, introduced in 2018, was described by Baidu's CEO as China's "first cloud-to-edge" AI chip, designed for handling AI workloads across various computing environments [7]. - Kunlunxin was spun off as an independent company in April 2021, with its initial valuation at 13 billion yuan, and Baidu currently holds a 59.45% stake, down from 70% in 2021 [8].