Core Insights - Super Micro Computer, Inc. has expanded its NVIDIA Blackwell architecture portfolio with new liquid-cooled NVIDIA HGX B300 systems, enhancing GPU density and power efficiency for hyperscale data centers and AI factory deployments [1][2] Product Features - The new 2-OU (OCP) liquid-cooled NVIDIA HGX B300 system can support up to 144 GPUs in a single rack, designed for space-efficient racks while maintaining serviceability [2][5] - The 4U Front I/O HGX B300 Liquid-Cooled System offers similar compute performance in a traditional 19-inch EIA rack, capturing up to 98% of heat generated through liquid-cooling technology [3][5] - Both systems feature significant performance improvements, including 2.1TB of HBM3e GPU memory and doubled compute fabric network throughput up to 800Gb/s when integrated with NVIDIA Quantum-X800 InfiniBand [4][6] Efficiency and Cost Savings - Supermicro's DLC-2 technology allows data centers to achieve up to 40% power savings and reduce water consumption, eliminating the need for chilled water and compressors [6] - The new systems are designed to accelerate time-to-online for hyperscale, enterprise, and federal customers by being fully validated and tested before shipment [6] Market Positioning - The introduction of these systems expands Supermicro's portfolio of NVIDIA Blackwell platforms, which are optimized for a wide range of AI applications and use cases [7] - Supermicro positions itself as a leader in Application-Optimized Total IT Solutions, focusing on innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure [8]
Supermicro Expands NVIDIA Blackwell Portfolio with New 4U and 2-OU (OCP) Liquid-Cooled NVIDIA HGX B300 Solutions Ready for High-Volume Shipment