Applied Materials(US:AMAT) Chan Ye Xin Xi Wang·2025-12-10 01:36Core Insights - Laser heat treatment equipment is becoming a necessary investment in advanced semiconductor manufacturing as semiconductor processes continue to evolve [1][5] - The penetration rate of laser technology in China's heat treatment equipment market is 16.01%, significantly lower than the global average of 25.89%, indicating substantial growth potential for the market [4][5] - The market size for China's laser heat treatment equipment is projected to reach approximately $1.519 billion in 2024, with a growth rate of 26.14% compared to 2023, and is expected to reach $1.728 billion in 2025 and $3.296 billion by 2030 [1][5] Industry Overview - Heat treatment is a critical process in semiconductor manufacturing, used for repairing lattice damage, activating impurities, and modifying material crystallization [2][4] - Laser heat treatment is characterized by its strong spatial selectivity, short processing cycles, and high flexibility, making it suitable for the trends of miniaturization and complexity in semiconductor manufacturing [3][4] Market Dynamics - The laser heat treatment equipment market is classified into laser annealing and laser material modification, with high technical barriers and significant R&D investment [4] - The value of heat treatment equipment in the semiconductor market has reached 3%, comparable to other essential processes like ion implantation and cleaning [4] Competitive Landscape - The global and Chinese laser heat treatment equipment market is dominated by foreign companies such as Veeco, Sumitomo Heavy Industries, and Dean Technology, which collectively hold over 80% of the market share [5][8] - Domestic companies like Shanghai Micro Electronics, Huazhuo Precision, and Lepu Technology are gaining market share in China due to their cost advantages and increasing technological capabilities [5][8] Industry Trends - The advantages of laser heat treatment technology become evident as logic chip processes enter below 40nm, making it an essential process below 28nm [15] - The introduction of new materials and structures, such as SiC/GaN and trench-type IGBTs, will provide additional growth opportunities for the laser heat treatment equipment market [15] - The shift towards three-dimensional integration in integrated circuits aligns well with the capabilities of laser heat treatment technology, which offers efficient and precise energy delivery [15]