券商晨会精华 | 未来PCB将更加类似于半导体 价值量将稳步提升
智通财经网·2025-12-11 00:54

Market Overview - The market experienced a rebound with a trading volume of 1.78 trillion yuan, a decrease of 125.4 billion yuan compared to the previous trading day. The Hushen index fell by 0.23%, while the Shenzhen Component Index rose by 0.29% and the ChiNext Index fell by 0.02% [1] Federal Reserve Insights - CICC indicated that the Federal Reserve is likely to remain steady in January, with the next rate cut expected in March. The Fed's decision to cut rates by 25 basis points in December was met with increased opposition from officials, indicating a higher threshold for further cuts. The Fed's announcement of short-term Treasury bill purchases has alleviated market concerns, but the outlook remains cautious due to persistent inflation [2] PCB Industry Analysis - CITIC Construction Investment believes that the PCB industry will increasingly resemble the semiconductor sector, with value steadily increasing due to rising demand for orthogonal backplanes and Cowop process upgrades. Major tech companies like Amazon, META, and Google have weaker chip design capabilities compared to Nvidia, leading to higher material requirements and more elastic value. Continuous upgrades in PCB technology are expected to drive upstream industry enhancements, with domestic PCB companies gaining global market share [3] Two-Piece Can Market Outlook - Galaxy Securities reported that the domestic two-piece can market is expected to see an upward shift in profitability due to an optimized competitive landscape. The market size reached 44.7 billion yuan in 2023, with a compound annual growth rate of 8.3% from 2018 to 2023, projected to reach 77.6 billion yuan by 2030. The industry's pricing dynamics are closely tied to capacity digestion and market concentration, with expectations for improved profitability and value recovery as major players consolidate their market positions [4]