Zhong Guo Neng Yuan Wang·2025-12-12 03:04Group 1: AI and Storage Demand - The demand for high bandwidth and high-density memory is increasing due to the preprocessing of massive data and loading of large model parameters in the AI era. An AI server requires 8 times more DRAM and 3 times more NAND compared to a regular server, leading to a surge in demand for high-performance storage products like HBM and DDR5 [1] Group 2: 3D NAND Technology - The 3D NAND technology is a key trend in the semiconductor industry, significantly enhancing storage performance and capacity by vertically stacking memory cells. This method allows for increased density without relying solely on smaller process nodes, which face reliability issues below 15nm [2] Group 3: Non-Destructive Testing Methods - Non-destructive testing methods such as ultrasound and X-ray are crucial for ensuring the quality of advanced packaging in semiconductor manufacturing. These methods help in detecting internal structures and interface integrity, which are vital for maintaining yield stability in 3D stacking processes [2] Group 4: Recommended Companies - Companies like Jiao Cheng Ultrasound and Ri Lian Technology are highlighted for their innovative solutions in the semiconductor field. Jiao Cheng Ultrasound has developed a wafer-level ultrasonic scanning microscope for defect detection in semiconductor packaging, while Ri Lian Technology's open-ray source technology aids in identifying deep internal defects in chips [3]