Advantest and Tokyo Seimitsu Announce Joint Development of Die-Level Prober

Core Insights - Advantest Corporation and Tokyo Seimitsu are collaborating to develop a new die-level prober aimed at testing high-performance computing (HPC) devices [1][2][3] Company Overview - Advantest is a leading manufacturer of automatic test and measurement equipment for semiconductors, with applications in 5G, IoT, autonomous vehicles, HPC, AI, and machine learning [6] - Tokyo Seimitsu specializes in precision measurement technologies and semiconductor production equipment, aiming to create innovative solutions for the semiconductor industry [5][6] Market Trends - The semiconductor industry is expected to see advancements in complexity and performance, particularly in AI and HPC devices, which require high computational power and advanced packaging technologies [2][3] - The collaboration between Advantest and Tokyo Seimitsu is positioned to address the challenges of testing these advanced devices, particularly in temperature control during testing [3][4] Strategic Collaboration - The partnership aims to leverage the expertise of both companies to enhance probing capabilities essential for the evolving AI and HPC markets [2][5] - Both companies emphasize the importance of collaboration across the semiconductor value chain to meet customer demands and drive innovation [2][5]